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Embedded World 2026 once again highlighted the extraordinary momentum of the embedded and IoT ecosystem, with AI, Physical AI, pervasive connectivity, and smarter edge architectures taking center stage. More than 36,000 professionals converged to explore how intelligence is increasingly shifting into devices themselves, making IoT systems more autonomous, responsive, and interconnected than ever.

AI and Physical AI: Now Core to Embedded Innovation

Across the exhibition halls, one message was unmistakable: AI has become a foundational capability in modern embedded systems. IoT devices are evolving into intelligent, perceptive endpoints capable of real‑time decision‑making.

A major theme this year was Physical AI, systems that not only compute but dynamically sense, interpret, and act within the physical world. From robotics and machine vision to industrial automation and advanced sensing, Physical AI is redefining what devices can do at the edge. This shift amplifies the importance of connectivity. For Physical AI to work, devices must stay continuously aware of, and engaged with, their environment, cloud platforms, peer devices, and city or industrial infrastructure. Reliable, low‑power, secure connectivity has become a non‑negotiable enabler of this new class of intelligent systems.

Connectivity in Action: Microchip’s Smart City Demo Featuring Sequans

Connectivity as the backbone of smarter systems was clearly illustrated by demonstrations across the show floor. One notable example was Microchip’s range of live demos showcasing advanced connected solutions. Additionally, Sequans technology made a strong appearance at Embedded World 2026 through partner demonstrations highlighting high‑performance, resilient, multi‑band connectivity, capabilities essential for smart city infrastructure, mission‑critical IoT, and edge intelligence scenarios. These technologies illustrate how reliable, efficient connectivity enables smart cities to scale Physical AI use cases, from sensing to automation and infrastructure coordination.

Strategic Alignment: Our Direction Mirrors Market Acceleration

In this rapidly evolving landscape, our strategy is aligned with the key industry drivers:

• Ultra‑low‑power intelligence at the edge
• Physical AI systems requiring always‑on sensing and decision‑making
• High‑reliability connectivity as the glue enabling devices to interact with the world
• Ecosystem collaboration with IoT innovators and partners

This year’s event also highlighted this direction in action, with Ambiq showcasing an AI‑powered connected healthcare demo that leveraged Sequans Monarch LTE-M connectivity, demonstrating how ultra‑low‑power processing and reliable wireless communication come together to enable advanced, real‑world applications.

Our collaboration with Ambiq reinforces this strategic direction by supporting energy‑efficient, intelligent, and connected endpoints, precisely where the embedded ecosystem is heading.

RF Innovation: Enclustra Showcases the Sequans IRIS SQN9506 RF Transceiver

Another highlight of Embedded World 2026 came from the RF and SDR domain, where Enclustra hosted Sequans on their booth, showcasing the integration of the Sequans Iris SQN9506 wideband RF transceiver into the Enclustra SDR platform. The showcase featured a high‑performance software‑defined radio architecture capable of ultra‑wideband operation, anti‑jamming performance, and simultaneous terrestrial and SATCOM connectivity, illustrating how advanced RF technologies are evolving to meet the needs of mission‑critical IoT, UAV, and hybrid communication systems. This collaboration demonstrated how powerful SDR platforms combined with next‑generation RF silicon can unlock new levels of flexibility and resilience for future connected devices.

Ecosystem Highlights: IoT Stars & DPTechnics

Embedded World’s energy extended beyond the show floor, particularly at IoT Stars, the vibrant community gathering uniting innovators and founders. DPTechnics energized the event with a contest featuring their Walter device powered by Sequans  as the prize, drawing strong engagement from attendees.

Meanwhile, SG Wireless contributed to the momentum with an Edge AI demo using their F1 module, powered by Sequans Monarch, running a TinyML image‑recognition model. This was a compelling illustration of ultra‑low‑power Physical AI at the edge.

The Verdict: A New Era of Intelligent, Connected, Power‑Efficient Devices

Embedded World 2026 made one thing abundantly clear: the era of passive, cloud‑dependent IoT is over.

A new generation of intelligent, autonomous, and resilient edge devices is emerging, powered by Physical AI and advanced cellular connectivity.

What stood out this year was how seamlessly ultra‑low‑power computing and reliable cellular connectivity now operate together to produce real‑world impact. From smart cities to connected healthcare, the direction is clear:

Intelligence belongs at the edge.
And it must remain connected.